4 Inch MPPO Matte Surface Waffle Pack Chip Trays For Bare-Die

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Shenzhen Hiner Technology Co.,LTD

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City: Shenzhen

Province/State: Guangdong

Country/Region: China

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4 Inch MPPO Matte Surface Waffle Pack Chip Trays For Bare-Die

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4 Inch MPPO Matte Surface Waffle Pack Chip Trays For Bare-Die

MPPO Waffle Pack Chip Trays Designed for bare die and small chip packaging, our waffle pack trays ensure secure, static-safe storage in precision grid arrays. The tray can carrier component also ...

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MPPO Waffle Pack Chip Trays

Waterproof Waffle Pack Chip Trays

Waffle ic tray

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