ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package
Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules.
IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).
Laser Bar or Touch Bar and other products are light and brittle, and it is easy to cause oxidation or damage due to improper operation. Under the fully automated operating system, there are strict requirements on packaging materials and boxes. The anti-static trays produced not only need to fully protect the products, but also need to deal with debugging such as the turnover of automatic equipment.At the same time in the process of transportation and transit also have high requirements, our company has accumulated a lot of experience in the production of such products, can fully respond to the diversified needs of customers, to provide set design.One - stop packaging solution production
Advantages
1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement
| Outline Size |
Material |
Surface Resistance |
Service |
Flatness |
Color |
| 2" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.2mm |
Customizable |
| 3" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.25mm |
Customizable |
| 4" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.3mm |
Customizable |
| Custom size |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
TBC |
Customizable |
| Provide professional design and packaging for your products |
| Usage |
Packaging of Electronic Components,Optical device, |
| Feature |
ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material |
MPPO.PPE.ABS.PEI.IDP...etc |
| Color |
Black.Red.Yellow.Green.White and custom color |
| Size |
Customized size, rectangle,circle shape |
| Mold type |
Injection Mold |
| Design |
Original sample or we can create the designs |
| Packing |
By Carton |
| Sample |
Sample time: after draft confirmed and payment arranged |
| Sample charge: 1. Free for stock samples |
| 2. Custom Tray negotiated |
| Lead Time |
5-7 Working days |
| The exact time should according to the ordered quantity |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Product Tags:
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ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC Images
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