High Quality Black 4 Inch ESD Waffle Pack for Micro IC Chips
Hiner-pack production IC tray waffle pack is in line with international environmental standards,through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.
It is by virtue of excellent professional team and unremitting efforts that Hiner-pack has been widely recognized by customers in the field of semiconductor materials.We take quality as the basis of survival and development, cooperate with customers and partners, long-term development, committed to become the semiconductor industry manufacturing and process materials in the world's leading service providers.
Details About HN21077 ESD Waffle Pack
The HN21077 is usually used to carry smaller chips or components, And the product can be matched with the cover plate, clip, Tyvek paper and other corresponding accessories. Our company provides complete packaging services to ensure the safety of customers' product transfer, transportation and storage.
| Outline Line Size |
101.6*101.6*4.5mm |
Brand |
Hiner-pack |
| Model |
HN21077 |
Package Type |
IC Parts |
| Cavity Size |
13.2*1.2*0.32mm |
Matrix QTY |
26*5=130PCS |
| Material |
PC |
Flatness |
MAX 0.1mm |
| Color |
Black |
Service |
Accept OEM,ODM |
| Resistance |
1.0x10e4-1.0x10e11Ω |
Certificate |
ROHS |
Product Application Of Waffle Tray
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging Of Chip Tray
Packaging Details:Cartons or packing according to customer's requirements
| Outline Size |
Material |
Surface Resistance |
Service |
Flatness |
Color |
| 2" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.2mm |
Customizable |
| 3" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.25mm |
Customizable |
| 4" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.3mm |
Customizable |
| Custom size |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
TBC |
Customizable |
| Provide professional design and packaging for your products |
Service
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity
FAQ
Q1: Are You Manufacturer or Trade Company?
A:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China..
Q2. Can I order if quantity less than MOQ?
A:Yes and it would be taken as sample order to production. We take more serious on sample order.
Q3. Can I get Free Samples?
A:Yes, If samples we have in stock would be provided for testing, but shipment should at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.
Q4. Do you arrange shipment for the products?
A:It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
Product Tags:
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Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips Images
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