SGS Chip Tray Waffle Pack For Optical Device Packaging 0.2mm Flatness
A semiconductor packing material is a material whose ability to conduct electricity is intermediate between a conductor and an insulator. It is a kind of electronic material with semiconductor properties, which can be used to make semiconductor devices and integrated electricity. Its conductivity is in the range of 10 (U-3) ~ 10 (U-9) ohm/cm. In some cases, a semiconductor has the property of conducting electricity.
Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded - the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.
Details about HN21082 Customized PC 4 Inch Waffle Pack
PC is a kind of amorphous thermoplastic resin with excellent comprehensive performance, which makes the HN21082 waffle pack excellent electrical insulation, elongation, dimensional stability and chemical corrosion resistance. At the same time with self-extinguishing, flame retardant, non-toxic, coloring and other advantages to ensure the safety of customers' products.
| Outline Line Size |
50*50*4.0mm |
Brand |
Hiner-pack |
| Model |
HN21082 |
Package Type |
IC Parts |
| Cavity Size |
18.5*0.95*0.32mm |
Matrix QTY |
12*2=24PCS |
| Material |
PC |
Flatness |
MAX 0.2mm |
| Color |
Black |
Service |
Accept OEM,ODM |
| Resistance |
10E04Ω-10E11Ω |
Certificate |
SGS |
Application Of Waffle Pack
Semiconductor Electronic component factories
SMT Surfacing factories Optical industry
| Outline Size |
Material |
Surface Resistance |
Service |
Flatness |
Color |
| 2" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.2mm |
Customizable |
| 3" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.25mm |
Customizable |
| 4" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.3mm |
Customizable |
| Custom size |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
TBC |
Customizable |
| Provide professional design and packaging for your products |
Advantages
1. Light weight, saving transportation and packaging costs
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release
4. High temperature resistance, suitable for high temperature automation equipment assembly
5. Corrosion resistance, suitable for all kinds of production conditions of products
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement
FAQ
Q1: Are You Manufacturer or Trade Company?
A:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
A:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
A:Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
A:Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
A:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
A:Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
A:We can send you them right now if you are interested in something we have stock, and
the project depending on the specific time.
Product Tags:
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SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging Images
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