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Chemical Resistance And Injection Mold In Custom Jedec Trays For Electronics Parts Packing

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Chemical Resistance And Injection Mold In Custom Jedec Trays For Electronics Parts Packing

Brand Name : Hiner-pack

Model Number : JEDEC TRAY SERIES

Place Of Origin : SHENZHEN CN

Certification : ISO 9001 ROHS SGS

MOQ : 1000

Price : $1.5~$6(Prices Are Determined According To Different Incoterms And Quantities)

Packaging Details : 70~100pcs/carton(According To The Customer Demand)

Delivery Time : Mold:About 25 Days / Product:7~10 Days

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Stacking Height : Customized

Service : Accept OEM,ODM

Surface Resistance : 1.0x10E4~1.0x10E11Ω

Temperature : 80°C~180°C

Shape : Rectangular

Material : MPPO, PPE, ABS, PEI, IDP, Etc

Customized Service : Support Standard And Non-Standard,Precision Machining

Injection Mold : Customized Case Need (Lead Time 25~30 Days, Mold Life Span: 300,000 Times.)

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Product Description:

The outline dimensions of all JEDEC matrix trays are 12.7 x 5.35 inches (322.6 x 136mm). Low profile trays with thickness of 0.25-inch (6.35mm) accommodate 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. A high profile 0.40-inch (10.16mm) version is available to hold thick (high) components such as PLCC, CERQUAD, PGA (Pin Grid Arrays), modules and assemblies.

A lot of thought was put into the design of JEDEC trays. Trays are configured with flat cells in the center area to allow automated handing by vacuum pick up tools. A scalloped feature is sculpted into one side of the tray to allow the use of a pin to mechanically fix correct orientation during use. A 45-degree chamfer in one corner provides a visual indicator of Pin 1 orientation of the components mounted in the tray.

Technical Parameters:

Brand Hiner-pack Outline Line Size 322.6*135.9*7.62mm
Model HN24037 Cavity Size 11*7*1.3mm
Package Type IC Component Matrix QTY 12*20=240PCS
Material MPPO Flatness MAX 0.76mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS
Chemical Resistance And Injection Mold In Custom Jedec Trays For Electronics Parts Packing

Applications:

• Packaging – at their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.

• Transportation & Storage – parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.

• Protection – JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage

• Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor and PC board manufacturing equipment. With decades of history and familiarity, support products for JEDEC trays are widespread and global. This includes corrugated boxes, protective covers, retaining straps, modular feeders, and a wealth of industry knowledge.

Chemical Resistance And Injection Mold In Custom Jedec Trays For Electronics Parts Packing

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